Press-fit terminals provide a solder-free capability to mount power modules to a printed circuit board (PCB). Microchip Technology Inc. has announced a broad portfolio of SP1F and SP3F power modules available with press-fit terminals that address the demands of high-volume manufacturing for applications such as E-mobility, sustainability and data centers.
(Source: Microchip Technology Inc.)
The solder-free, press-fit power module terminals enable automated or robotic installation that speed up the assembly process while reducing cost. The power modules combine high accuracy of the terminal locations with a press-fit design, enabling a high-reliability contact, the company said.
Using press-fit technology, power module pins are not soldered to the PCB. The connection is made by pressing the pins into properly sized PCB holes, eliminating wave soldering. This is beneficial when a PCB also houses surface-mount technology (SMT) components.
Microchip offers more than 200 variants available in its power modules portfolio. Options include the use of mSiC technology or silicon (Si) semiconductors with several topologies and ratings. The SP1F and SP3F deliver a voltage range of 600 V-1700 V and up to 280 A. The modules are fully RoHS compliant.
Press-fit terminal options are currently available. Application note AN4322 delivers detailed mounting instructions for SP1F and SP3F press-fit use.
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