At CES 2024, TDK Corp. launched a range of new MEMS sensors for consumer, industrial and automotive applications as well as an advanced edge machine learning (ML) solution. The company also announced the availability of several previously-announced products.
The global MEMS market is expected to reach $20 billion in 2028, up from $14.5 billion in 2022, growing at an annual compound annual growth rate of five percent, according to Yole Group’s industry report. The consumer segment continues to be the largest driver, especially with new wearable applications, followed by the automotive sector.
Machine learning
As new use cases emerge for edge AI/ML, TDK introduces the InvenSense SmartEdgeML, an advanced edge ML solution designed for wearables, hearables, AR glasses, IoT devices and other products that can leverage ML at the sensor chip level. SmartEdgeML allows developers and designers to implement ML-optimized motion sensor algorithms on an IMU sensor chip. It can generate and run ML models on a 2.5 × 3-mm six-axis motion sensor inertial measurement unit (IMU) at <30 µA.
The SmartEdgeML is comprised of three key components: the sensor inference framework (SIF), the InvenSense ICM-45686-S IMU and the SmartBug 2.0 evaluation kit, a multi-sensor wireless module consisting of the ICM-45686-S IMU.
The SIF is TDK’s software ML framework that allows users to collect IMU sensor data and select custom features and then build, test, deploy and run those models on the ICM-45686-S IMU through the SmartBug 2.0 module. Algorithms include exercise classification (squats, jumping jacks, lateral raises and push-ups) and wrist gesture classification (fight, turn, shake and still).
The ICM-45686-S IMU is a 2.5 × 3-mm IMU in the Balanced Gyro family that enables ML models to run on-chip at low current consumption. It can be used for a range of applications, including AR glasses, VR, OIS, drones, TWS and robotics.
TDK also announces the availability of the InvenSense SmartBug 2.0 (MD-45686-ML). This SmartBug upgrade introduced ML, enabling developers to use SmartBug 2.0 with the company’s SIF to build ML solutions. The SIF is now available for download, while the MD-45686-ML and ICM-45686-S will be available at distributors by February 1, 2024.
MEMS motion sensors
For consumer and industrial applications, TDK announced the availability of two high-performance InvenSense motion sensors. This includes the new premium InvenSense SmartMotion ICM-42370-P 3-axis accelerometer for consumer applications that require low noise and high sensitivity. It offers industry-leading low noise performance and up to ±16 g of measurement range. Other features include a 16-bit ADC for high accel sensitivity and support for a range of on-chip motion event/activity detection based on interrupt or register access, without additional user programming. Applications include home/industrial appliances, security cameras as well as consumer or medical wearables. The new ICM-42370-P IMU will be available at distributors by February 1, 2024.
TDK also announced that the InvenSense SmartIndustrial IIM-42653, a high-FSR IMU for industrial applications. It is now available in full-scale production.
This six-axis IMU can achieve a gyro-programmable digital output of ±4000 dps and an accelerometer-programmable output of ±32 g with ultra-low gyro noise. Applications include industrial or high-end grade AGV, AMR and drones.
SmartAutomotive
TDK introduced the final transition of its SmartAutomotive non-safety automotive family to 105°C with the launch of the InvenSense SmartAutomotive IAM-20381HT high-temperature three-axis MotionTracking accelerometer. This device can be used in automotive applications such as navigation, infotainment systems and telematics. It is automotive-qualified up to 105°C based on AEC-Q100 grade 2.
The IAM-20381HT is part of a fully-compatible (pin-to-pin and register compatible), multi-axis, multi-grade portfolio of SmartAutomotive products. The MEMS accelerometer, housed in a 3 × 3 × 0.75 mm (16-pin LGA) package, features two programmable independent interrupt lines, wake-on-motion functionality, and a FIFO up to 4096 bytes. These features can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst-read sensor data and then go into a low-power mode as well as enable a variety of motion-activated functions such as anti-theft, vehicle security and driving style data recording, TDK said. The IAM-20381HT will be available at distributors worldwide by February 1, 2024.
TDK will demo these new MEMS sensors and the ML solution at CES, booth #20521 in the Central Hall (LVCC). Demos include building an ML algorithm on a 2.5 × 3-mm motion sensor in less than five minutes.
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