Micron samples smallest UFS 4.0 storage chip

At Mobile World Congress (MWC) 2024, Micron Technology, Inc. announced qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile storage solution in the industry’s smallest UFS package, measuring 9 × 13 mm. The mobile storage chip features Micron’s new proprietary firmware upgrades that focus on delivering optimized and higher performance for flagship smartphones.

(Source: Micron Technology, Inc.)

Aimed at AI-driven smartphones, the UFS 4.0 solution, built on Micron’s advanced 232-layer 3D NAND, offers up to 1 terabyte (TB) capacity and up to 4300 megabytes per second (MB/s) sequential read and 4000 MB/s sequential write speed, which is twice the performance of previous generations. The new solution also delivers improved data-intensive experiences in generative AI applications with large language models loading 40% faster when initialing conversations with AI digital companions.

The smaller footprint, compared with the UFS 4.0 solution in a 11 × 13-mm package introduced in June 2023, yields space savings for foldable and ultra-slim smartphones or more space for larger batteries. In addition, the solution offers a 25% increase in power efficiency to extend battery life, even when running power-hungry features like AI, augmented reality, gaming and multimedia apps.

Building on Micron’s high-volume production of UFS 4.0 storage last year, the new mobile flash storage delivers custom firmware updates, designed to significantly improve smartphone performance. Highlights include High-Performance Mode (HPM), One Button Refresh (OBR) and Zoned UFS (ZUFS).

HPM is a proprietary feature that optimizes performance by prioritizing critical tasks over background tasks during intensive smartphone use, delivering over 25% improvement in speed. OBR automatically cleans and optimizes data, so smartphones continue operating in a “like-new state” with 10% faster app launches.

With ZUFS, Micron UFS 4.0 allows the host to specify different zones where the data is stored. It “reduces write amplification to maximize the finite cycles of data that devices can program and erase without degrading device performance,” Micron said, “ultimately extending the smartphone life span while keeping devices feeling like new for longer.”

Micron also announced that its UFS 4.0 and LPDDR5X memory devices are designed into Samsung’s flagship Galaxy S24 series (Galaxy S24 Ultra, S24+ and S24) smartphones, featuring Samsung’s suite of generative AI tools, Galaxy AI. Micron said the LPDDR5X is the industry’s only mobile-optimized memory offering with the advanced capabilities of the 1β (1-beta) process node.

Micron is shipping samples of its upgraded UFS 4.0 with capacities of 256 gigabytes (GB), 512 GB and 1 TB. The company is exhibiting at MWC Barcelona 2024, Hall 7, Stand 7A21EX and 7A23Ex.