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Nexperia expands MOSFET families

Nexperia announced two MOSFET product line expansions at APEC 2024, including space-saving ASFETs for PoE and 40-V NextPowerS3 MOSFETs.

Nexperia announced the release of two new MOSFET families at APEC 2024, expanding its discrete switching lines for a variety of markets. The new products include 100-V application-specific MOSFETs (ASFETs) for power-over-Ethernet (PoE), eFuse and relay replacement in smaller DFN2020 packaging, and 40-V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance.

Space-saving PoE MOSFETs

The new 100-V PoE ASFETs solve two design challenges in PoE switch applications: the need to save space and safely managing fault conditions. The company first introduced its ASFET product line in 2020, with optimized features for specific applications.

Nexperia's ASFET in DFN2020 package and NextPowerS3 MOSFET in LFPAK56 package.

(Source: Nexperia)

The 100-V PoE ASFETs in 2 × 2 mm DFN2020 packaging use 60% less space than previous versions in LFPAK33 packaging. Any reduction in device footprint is an advantage when PoE switches typically have up to 48 ports, each requiring two MOSFETs for protection, Nexperia said.

The 100-V PoE ASFETs offer an improved safe operating area (SOA) by up to 3× with only a “minimal” increase in RDS(on). This is an important feature, particularly since these devices protect PoE ports by limiting inrush currents while managing fault conditions. These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications. They also can replace mechanical relays in smart thermostats, for example, the company said.

EMC-optimized NextPowerS3 MOSFETs

The NextPowerS3 MOSFETs are an alternative to more expensive MOSFETs and external snubber circuits, which increase component count. This MOSFET line provides similar EMC performance, compared to using an external snubber circuit, while also offering higher efficiency. These MOSFETs can be used in switching converters and motor controllers in a variety of applications and are available in LFPAK56 packaging.

“EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release,” Nexperia said.

Nexperia is exhibiting at APEC 2024, booth #1505.

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