Addressing the power integrity and voltage regulation required by high-performance system-on-chips (SoCs) and other large computing processors, Empower Semiconductor has launched the largest silicon capacitor in its ECAP product family for high-frequency decoupling. The new 16.6-μF EC1005P features ultra-low impedance up to 1 GHz in a low profile that can be embedded into the substrate or interposer of any SoC. This silicon capacitor is suited for high-performance computing (HPC) and artificial intelligence (AI) applications.
(Source: Empower Semiconductor)
“The performance of SoCs and other large computing processors are constantly increasing,” said Mukund Krishna, senior manager of product marketing, Empower Semiconductor, in a statement. “It is becoming increasingly difficult to reach the level of power integrity and voltage regulation that these devices require with conventional MLCCs. The EC1005P features close-to-ideal parasitic parameters, allowing these SoCs to operate with reduced voltage margining and ultimately reducing system power.”
Empower said the EC1005P ECAP addresses the “last-inch” decoupling gap from the voltage regulators to the SoC supply pins, replacing several discrete components with lower performance and a larger footprint, with a single monolithic device.
Other specs include an ultra-low sub-1-picohenry (pH) equivalent series inductance (ESL) and sub-3-milliohm (mΩ) equivalent series resistance (ESR). The silicon capacitor is housed in a 3.643 × 3.036-mm 120-pad chip-scale package (CSP), with a standard profile of 784-micron that can be customized for various height requirements. This device provides high stability over voltage and temperature and is not subject to derating or aging like traditional MLCCs, said the company.
The EC1005P ECAP is sampling now. Volume production is expected in the fourth quarter of 2024.
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