Accelerated simulation of thermal and mechanical reliability of electronic devices and circuits

The following research paper was discussed at the IEEE Workshop on Accelerated Stress Testing and Reliability.  It discusses an automated software system for simulation of electronic devices for both harmonic and random vibrations of single and multiple impacts, linear acceleration and acoustic noise, and stationary and non-stationary thermal effects. The program calculates the number of cycles to failure under mechanical loads, as well as, under cyclic thermal effects. Multiple approaches and models have been used to estimate reliability and to predict potential sources of failure.

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