ADS RF,microwave tool adds new improved features

ADS RF,microwave tool adds new improved features

The ADS 2012 RF and microwave EDA software platform features new capabilities that improve productivity and efficiency for all applications the system supports and breakthrough technologies applicable to GaAs, GaN and silicon RF power-amplifier multichip module design. The updated features include user interface enhancements which improve design efficiency and productivity, such as dockable windows for quickly accessing frequently used dialog boxes. Also included are updated Load Pull and Amplifier DesignGuides, which offer mismatch simulation and make it easy to see amplifier performance at a specific output power level or a specific amount of gain, respectively.

In addition the new update also improves integration with EMPro, which enables 3-D electromagnetic component designs to be saved as database cells for use directly in ADS. A new ADS electro-thermal simulator that incorporates dynamic temperature effects is added to improve accuracy in “thermally aware” circuit-simulation results.

Multichip module electromagnetic simulation setup and Finite Element Method simulation of different technologies to analyze electromagnetic interactions between circuits and interconnects, wire bond and flip-chip solder bumps in typical multichip RF power-amplifier modules.

Model support for Agilent’s artificial neural network-based NeuroFET model (extracted by Agilent’s IC-CAP device modeling software) to enable more accurate FET modeling and simulation results.(Contact company for pricing and availability)

By Christina Nickolas

Agilent Technologies , Santa Clara , CA
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