AdvancedTCA Summit runs October 16-18 in Santa Clara

AdvancedTCA Summit runs October 16-18 in Santa Clara

The third annual AdvancedTCA Summit will provide three days of up-to-date information on the state of AdvancedTCA and MicroTCA, the emerging standard platforms for communications equipment. Here are some key products that will be available for your inspection.

Diversified Technology (Booth 400) will demo a third generation of Ethernet-based ATCA switching that focuses on flexible 10G capabilities and multiple AMC sites. They will show three levels of Ethernet based hubs and an InfiniBand switch.

Elma Electronic (Booth 302) will announce the MicroBox 1U MicroTCA deployable solution unit that offers advanced cooling and compact size. The unit has the smallest form factor of any deployable MicroTCA unit available, with side-to-side cooling configuration that has no bends in the airflow path.

HARTING North America (Booth 208) will have on hand a portfolio of AdvancedMCTM connectors for AdvancedTCA and MicroTCATM applications that are compliant with PICMG specifications. They support transmission speeds up to 12.5 Gbits/s.

Interphase (Booth 108) will show the iNAV 31K AdvancedMC Carrier Card that provides four single-width, mid-size AdvancedMC bays with type B+ connectors and rear transition module support. It features a high performance Ethernet switch, 24 1-GbE ports and two 10-GbE ports, and an optional 8-port PCI Express switch.

Objective Interface Systems (Booth 419) will show the OBRexpress FPGA , a lightweight hardware implementation of CORBA targeted at FPGAs. The chip supports all standards-based CORBA operations and all data types. Message processing is performed directly in FPGA hardware and no GPP is required.

Performance Technologies (Booth 206) will demo AdvancedMC single-board compute modules for high-end packet processing or multi-threaded software applications. Single or multi-core options offer the speed required to extend AdvancedTCA/MicroTCA systems.

SMART Modular Technologies (Booth 410) introduces the industry’s first 4 Gbyte DDR2 CoolFlex Mini-Registered DIMM small form factor module for storage, networking, telecom, and server applications.

Southco (Booth 105) will introduce multiple module handles and light pipe bracket options designed to satisfy the requirements of the PICMG AdvancedMC standard (AMC.0) for use in telecom industry ATCA-chassis applications. Multiple options for each product provide complete compatibility with the industry standards, plus added features for enhanced performance and ease of use.

Telco Systems (Booth 403) will have PICMG 3.0/3.1 compatible hub blades that deliver unparalleled connectivity between AdvancedTCA chassis slots. The T-HUB offers high-bandwidth multi-layer networking, with separate base and fabric interface switching for enhanced security and field-proven carrier grade BiNOS networking operating system.

Tyco Electronics (Booth 304) Z-PACK TinMan product is a new high speed, 100-Ω impedance matched connector with extreme signal density. This connector can be pinned out for lower speed signal ended lines and exists in 3, 4, and 5 pair per column versions.

Yamaichi Electronics (Booth 310) provides AdvancedMC connectors in compression mount technology (CMT). CMT is the contact technology of the future and the only reliable one when it comes to real high speed applications in the MicroTCA and AdvancedTCA architectures.

Ulticom, Inc. (Booth 406) will show the Signalware MH0305 SS7 AMC interface board that provides high-density, high throughput connectivity for telecom applications built on AdvancedTCA and MicroTCA platforms. With its highly configurable design and ability to handle large volumes of SS7 network traffic, the Signalware MH0305 can be used to enable a broad range of VoIP, wireless, and next generation network elements.

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GoAhead Software (Booth 207) will have on hand GoAhead SAFfire, the open standards-based availability and management solution for carrier-grade and mission critical systems where downtime is unacceptable. SAFfire is the first ready-to-deploy implementation of the Service Availability Forum Application Interface Specification (AIS), ensuring application portability and provider choice.

Motorola (Booth 301) will show a new AdvancedTCA blade processor module – the ATCA-9301 – incorporating many-core technology that provides a substantial increase in performance and functionality for high-bandwidth packet processing applications. It features two Cavium Networks OCTEON sixteen-core processors with built-in hardware acceleration engines and 10-Gbit/s packet forwarding throughput.

Jim Harrison

Advanced TCA Summit, October 16-18 2007, Santa Clara, CA Convention Center, http://www.advancedtcasummit.com/