AOS unveils MRigidCSP for battery management

Alpha and Omega Semiconductor Limited (AOS) has unveiled its new MRigidCSP packaging technology for battery management applications. The new packaging is reported to decrease on-resistance, while increasing mechanical strength. It will be initially available for the AOCR33105E, a 12-V common-drain dual N-channel MOSFET. Target battery applications include smartphones, tablets and ultra-thin notebooks.

AOCR33105E in the MRigidCSP package (Source: Alpha and Omega Semiconductor)

The MRigidCSP packaging resolves a few key challenges around fast charging, which calls for lower power loss in the battery management circuit.

“As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications,” AOS explained. “A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength.”

AOS said the reduction in mechanical strength can result in more stress during the PCB assembly reflow, which could cause warping or cracking in the die as well as application failure.

The AOCR33105E is designed with the latest trench-power MOSFET technology in a common drain configuration. It features ultra-low on resistance and electrostatic discharge (ESD) protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits. The device is RoHS 2.0 compliant and halogen-free. Click here for more product resources.

Key specifications in the MRigidCSP package

Key specs of the AOCR33105E in the MRigidCSP package (Source: Alpha and Omega Semiconductor)

The AOCR33105E in the MRigidCSP package is available in production quantities with a lead time of 14-16 weeks. The device is priced at $0.405 in quantities of 1,000.