Audio IC enables slim designs for heat-sink-free 50-W systems
A member of the Sound Terminal family, the STA350BW audio IC is offered as the first to enable slimmer home audio designs that support up to 50 W of output power with no external heat sink. The part has digital audio processing on the chip and multiband dynamic range compression, which boosts audio clarity and system reliability. The device can also compensate nonideal speaker characteristics.
In addition, integrated protection features safeguard the system against a wide range of fault conditions. Run-time automatic diagnostic circuitry helps prevent failures and boosts the overall reliability of the application.
The IC’s power stage uses FFX technology to stream full digital audio to the speakers. This maximizes flexibility for configurable products by providing four selectable run-time output configurations supporting a choice of operating modes including 2.0, 2.1, or 1.0 channel, or 2.0-channel with a PWM output for an external subwoofer. The IC is housed in a PowerSSO 36-pin package. ($4.50 ea/1,000 — available now.)
By Christina Nickolas
STMicroelectronics , Lexington , MA
Information 781-861-2650
www.st.com
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