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AuSn in module enables 320°C assembly temps

AuSn in module enables 320°C assembly temps

An updated version of the OptoCooler HV14 enables assembly temperatures as high as 320°C, making it compatible with the industry-standard eutectic gold-tin (AuSn) solder for packaging optoelectronic devices. Applications include laser diodes, semiconductor optical amplifiers, and sensors.

AuSn in module enables 320°C assembly temps

The thermoelectric module is a high heat pumping device designed for standard electrical power requirements. At 85°C, it operates at a maximum of 2.7 V and can pump 1.7 W of heat in a footprint of 3 mm2 . The module can create a temperature differential up to 50°C between its hot and cold sides. (Contact 919-597-7300, or info@nextreme.com for pricing and availability.)

Nextreme , Research Triangle Park , NC
Information 919-990-8300

http://www.nextreme.com

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