Memory controller reference design targets edge AI and video processing
Lattice and Etron leverage their respective ECP5 FPGA and RPC DRAM technologies to develop a memory controller reference design as a replacement for external memory
Author: Gina Roos
Designing with WBG semiconductors takes a little extra know-how
Electromagnetic interference, paralleling, and layout are all things that engineers understand, but when transitioning from silicon-based chips to silicon carbide or
Power block MOSFET increases efficiency in a smaller package
Diodes’ half-bridge power block, integrating dual MOSFETs in a single 3.3 × 3.3-mm package, offers increased efficiency while reducing board space requirement by up
Tiny capacitor targets high-density applications
Murata offers an MLCC in a 008004 package size with a capacitance of 0.1µF for compact electronic devices, such as 5G smartphones and
Multi-chip capacitors address high-density packaging for power electronics
Kemet extends its KC-LINK capacitor family with high-density packaging for power applications that call for high power density and high efficiency in a small
Tact switch features ultra-low sound
C&K has expanded its family of soft-feedback tact switches with an ultra-low version, targeting automotive interior
SMT PCB edge connectors offer space savings
Keystone’s new series of SMT edge connectors offer a low profile for high-density
Integrated RS-485 transceivers reduce design time
Analog Devices’ series of reinforced iCoupler isolated RS-485 + integrated isolated DC/DC converters, housed in small SOIC packaging, offers a simplified PCB
SiGe rectifiers deliver high efficiency, thermal stability
Combining the best attributes of Schottky and fast-recovery diodes, Nexperia’s SiGe rectifiers enable designers to use these parts in high-temperature and
Automotive-grade MLCC chips target the powertrain
Murata’s automotive-grade MLCCs, targeting powertrain applications, can significantly reduce PCB deflection cracks thanks to bond metal terminals added to the external