What the updated DIN VDE V standard means for digital isolator certification
With the DIN VDE V 0884-11:2017-01 standard, IC manufacturers must upgrade to meet the new certification requirements or they will be required to remove VDE
Author: Gina Roos
AI: It changes everything
Chipmakers are making big strides in innovation, including new architectures and new techniques to deliver faster processing and lower power
Miniature tact switch rated to 10 million cycles
C&K claims the industry’s first miniature tactile switch that is rated to 10 million cycles, making them suitable for demanding applications, such industrial and
TE adds STRADA Whisper cable receptable for 112G PAM-4 data rates
TE Connectivity has extended its STRADA Whisper high-speed backplane connector family with a new cable receptable capable of handling up to 112G PAM-4 data rates in
Gate driver for SiC MOSFETs meets AEC-Q100 qualification
Power Integrations’ AEC-Q100–qualified SiC MOSFET driver incorporates active clamping
DC/DC buck converter offers stackability for improved size and thermal performance
TI’s stackable DC/DC buck converter, integrating up to four ICs, shrinks solution size while optimizing thermal
Processors roll for IoT and AI
Microprocessor and microcontroller makers are delivering improved chips that address power, cost, and security risks in IoT
Researchers find a better way to cool GaN devices
Georgia Tech researchers have developed a new bonding technique that can improve the cooling of GaN devices, which translates into better performance for a variety of
POL voltage regulators feature fast COT engine
Infineon’s OptiMOS IPOL integrated POL voltage regulators with an enhanced-stability COT engine offers high efficiency for server, base station, telecom, and storage
SiC power modules maximize switching efficiency
Microchip expanded its SiC power electronics family with new modules that deliver efficiency, size, and reliability