LED drivers eliminate heat sinks for smart lighting designs
The high efficiency of Power Integration’s LYTSwitch-6 LED drivers reduces ballast size, weight, and cooling airflow requirements.
Author: Gina Roos
Power modules address industrial and ITE applications
XP Power’s new series of rugged chassis- and DIN-rail mount DC/DC converters simplify installation in a variety of industrial and ITE
Battery management IC extends battery cell life for EVs
Renesas’ automotive-grade battery management IC maximizes battery cell life and driving range for hybrid and electric
ON Semiconductor delivers new PoE controllers for IoT endpoints
Supporting the IEEE 802.3bt standard, the PoE controllers can deliver high-speed connectivity up to 90 W of power over LAN connections.
Build an embedded robotics system in under 15 minutes
Texas Instruments added a new reusable and solderless robotics learning kit and curriculum for the university classroom, enabling students to build a fully functioning
Cable assembly adds popular connector
Amphenol RF expands its cable assembly line with a new BNC bulkhead to AMC micro connector
Board-to-board connectors feature low stacking heights
Kyocera’s board-to-board connectors offers a 0.5-mm pitch, and stacking height of 4 mm, making it suitable for space-constrained applications, including automotive
Scope accessory adds two-port shunt-through impedance measurement
The Picotest two-way wideband active splitter adds the power integrity verification measurement to oscilloscopes, traditionally only available on VNAs or
Lextar to roll out new miniLED backlight modules and displays
Lextar offers a new series of miniLED smart backlight modules that integrate miniLEDs and the driver IC for a high contrast and slim
Microchip adds two USB-PD chips
Microchip expands its USB Type-C portfolio with a certified USB 3.1 PD SmartHub IC and standalone USB Type-C PD