ST intelligent sensor processing unit combines MEMS sensor, DSP, and AI
STMicroelectronics’ unveils its new AI sensor design, an intelligent sensor processing unit that combines a MEMS sensor and DSP, capable of running AI
Author: Gina Roos
New products roundup: Digital ICs, IP&E, sensors, and power
Here is this week’s new products roundup, including digital ICs, motors, passive components, interconnects, power devices, and
Omnivision claims pixel technology breakthrough for image sensors
Omnivision has developed the smallest 0.56-micron pixel with high QE performance for image sensors used in multi-camera mobile
Infineon readies TPM for quantum computing security challenges
Infineon adds a PQC-protected firmware update mechanism to its latest OPTIGA TPM to address future quantum computing security
Health-care sensor interface IC integrates NFC energy harvesting
EnSilica has introduced an ultra-low-power sensor interface IC for monitoring vital signs in wearable health-care and medical
IR emitters deliver higher radiant intensity
Vishay’s VSMA10x IR emitters claim 30% higher radiant intensity than previous generation devices and 10% higher than competitive
Flex Power Modules releases its first two-phase voltage regulator module
Flex Power Modules introduces the BMR510, its first two-phase voltage regulator module, featuring a continuous total output current of 80
Nexperia shrinks SD-card level translator IC
Nexperia has claimed the smallest secure digital (SD) card level translator IC that is 40 percent smaller than previous 20-bump
Five mistakes to avoid when doing BGA rework
BGA rework is a complex and challenging task, requiring special care in set-up, skills, and inspection
SPDT RF relays operate up to 18 GHz
Teledyne Relays introduces two non-latching SPDT RF relays that operate up to 18 GHz, targeting telco, military, and RF test &