Ceva unveils edge AI NPUs for tinyML
Ceva’s Ceva-NeuPro-Nano edge AI NPUs claim the right balance of power, performance and cost to enable a wide range of TinyML
Author: Gina Roos
GL launches enhanced 5G Core test suite
GL Communications’ 5G Core network test suite enables the test and analysis of 5G Core networks for optimal
Automotive chip inductors save space
Bourns’ Model CWP3230A automotive-grade chip inductors, featuring high current, inductance and impedance, save space in PoC
Automotive relay delivers small size
FCL’s FBR53-LE automotive relay with a low profile offers lower power consumption and generates less
Samtec adds low-profile RF ganged connector
Samtec extends its Magnum RF family with a low-profile, right-angle RF ganged connector option for maximum channel
Magnachip develops one-chip PMIC for displays
Magnachip’s one-chip, multi-functional PMIC improves efficiency and provides lower power consumption for IT display
Infineon unveils PSU roadmap for AI data centers
Infineon releases its technology roadmap for energy-efficient PSUs to address the energy needs of AI data
Taking current sensing to the next level
The complexity and miniaturization of electronics make accurate and efficient current sensing critical to improve safety, reliability and
TDK launches InvenSense Sensor Partner Program
TDK unveils InvenSense Sensor Partner Program to help designers accelerate their IoT designs across a range of
Design kit streamlines PoE design
Bourns’ PoE-LAB1 design kit features 32 products to help designers implement power/data delivery and protection in PoE