APEC 2021 will be an online event in June APEC 2021 will be a virtual only-event consisting of a four-day conference with live educational sessions and a two-day
Rugged IMU targets construction, agriculture, and autonomous equipment Aceinna’s OpenIMU335RI rugged IMU provides 3D acceleration, 3D rate, and optional 3D magnetic field sensing for machine guidance and
Buck/boost regulator combines high efficiency and small size Maxim Integrated’s MAX38889 buck/boost regulator offers high efficiency in a small size for backup power applications using
Partnership yields AI-based 3D sensing reference designs for AIoT devices Ambarella, Lumentum, and ON Semiconductor have developed two joint AI-based 3D sensing reference designs to drive AIoT device
Is IoT fulfilling its potential and how will 5G help? The IoT & 5G World virtual conference in June 2021 looks at the reality of where we are with IoT
40-V power MOSFETs deliver high power density Nexperia’s 40-V power MOSFETs in the LFPAK88 package delivers more than 50× greater power densities than traditional D2PAK
Reference design simplifies end-of-arm tooling development Trinamic’s end-of-arm tooling reference design with integrated hardware-based FOC and IO-Link communication cuts development time in
PowerUP 2021 opens a call for papers A call for papers is now open for the PowerUP Expo, a three-day virtual conference and exhibition focusing on
GaN power adapter reference design delivers high power density Silanna and Transphorm develop a 65-W USB-C PD GaN adapter reference design that delivers high power density and 94.5%
Survey: Engineering inefficiency delays new product introductions Instrumental’s NPI survey found that engineering inefficiency and low technology adoption delay 43% of electronics new product