Load switches deliver smart power to digital ICs Diodes Inc. expands the DML30xx series of smart load switches with four new high-current-rated
Testing space-grade processors for data compression Teledyne e2v tests and evaluates its LS1046 and LX2160 space-grade processors for data compression in space
What’s new in sensor fusion for mobile devices The latest use cases and features enabled by sensor fusion include TWS earbuds with spatial audio and sports earbuds with heart rate
Gate driver chipset targets clean energy Allegro MicroSystems launches a new Power-Thru isolated gate driver chipset that maximizes power efficiency in clean energy
IR emitters deliver higher radiant intensity Vishay’s AEC-Q102-qualified VSMA IR emitters offer 10% higher radiant intensity in a 20% smaller footprint for automotive
Wireless-charging boards simplify fast charging STMicroelectronics releases Qi-compatible transmitter and receiver wireless-charging boards for high-power
Half-bridge MOSFET saves space Alpha and Omega Semiconductor’s AONG36322 XSPairFET half-bridge MOSFET saves space in DC/DC applications, enabling more efficient
Microchip expands radiation-tolerant MCU family Microchip’s SAMD21RT MCU meets stringent radiation and reliability standards, targeting space-constrained
DC/DC converters ease integration, save space ST’s A6983/A69831 DC/DC converters target automotive applications including body elements, audio systems and inverter gate
Angle sensors deliver high stray field immunity Infineon’s XENSIV TLE49SR angle sensors combine high stray field immunity with high accuracy for safety-critical automotive chassis