TE adds SFP-DD I/O interconnects for high-speed networking TE Connectivity has extended its SFP portfolio with SFP double density (SFP-DD) I/O interconnects for higher density and faster data transfer
RGB-LED driver delivers smart automotive lighting Melexis’ MLX81116 RGB-LED driver with its MeLiBu high-speed communication interface enables smart animated automotive lighting for improved
48-V mobility reference design uses modular approach for faster design Renesas has introduced a 48-V mobility reference design that allows developers to select different functional blocks for a range of
Automotive-grade dual inductor saves board space Vishay’s high-current dual inductor reduces board space requirements and offers improved total harmonic distortion over other inductor
Sampling oscilloscope platform delivers faster test times Tektronix’s new sampling oscilloscope platform for testing optical transceivers includes an oscilloscope, optical sampling modules, and new
OmniVision improves mainstream security image sensor OmniVision has launched a new mainstream security image sensor with improved SNR1 and lower power consumption for consumer-grade IoT security
Microchip doubles serial EEPROM density to 4-Mbit Microchip has unveiled its highest density 4-Mbit serial EEPROM memory, designed to give developers greater design flexibility and
Aluminum electrolytic capacitors rated at 5,000 hours CDE has improved its THA/THAS aluminum electrolytic capacitors with a rated life of 5,000 hours, a 66 percent increase over first-generation
Inclinometer with ML core delivers high accuracy, low power STMicroelectronics has released a new 2-axis inclinometer with high accuracy and low power for industrial automation and structural health
How the DICE standard delivers strong security for IoT devices The Trusted Computing Group’s Device Identity Composition Engine (DICE) standard addresses security in resource-constrained and low-cost IoT