POF transceivers deliver high voltage isolation Firecomms’ RedLink POF transceivers deliver high voltage isolation and EMI immunity for industrial power electronics
AmberSemi and ST demo reference design for BLDCs AmberSemi and STMicroelectronics announced their jointly developed reference design for brushless motors at APEC
Solid-state isolators deliver faster switching Infineon’s iSSI solid-state isolators with coreless transformer technology deliver faster switching with up to 70% lower power
GaN switcher ICs cut power system losses Power Integrations’ GaN switcher ICs, combining AC/DC and DC/DC stages in a single power converter, cut power system losses by up to
Integrated GaN HEMT ICs save board space Innoscience’s family of 700-V integrated GaN HEMT ICs reduce component count and design
EPC claims lowest on-resistance GaN FET EPC unveils the first GaN FET with 1-mΩ on-resistance in a QFN package for DC/DC conversion, fast charging, motor drives and solar
CoolSiC MOSFETs target hi-rel applications Infineon’s 750-V G1 CoolSiC MOSFETs address requirements for higher efficiency and power density in industrial and automotive power
Qorvo adds 1200-V SiC modules in compact package Qorvo expands its SiC power portfolio with four 1200-V SiC modules, including half-bridge and full-bridge topologies, in a compact E1B
Nexperia expands MOSFET families Nexperia announced two MOSFET product line expansions at APEC 2024, including space-saving ASFETs for PoE and 40-V NextPowerS3
Micron samples smallest UFS 4.0 storage chip Micron is sampling an enhanced version of its UFS 4.0 storage chip in a compact package, targeting AI apps in