Partnership makes it easier to develop Matter devices
A collaboration between Silicon Labs and Arduino enables developers to go from new boards to commissioned Matter devices in less than two
Author: Gina Roos
Three predictions for the intelligent IoT edge
Eseye’s latest IoT predictions report calls 2024 ‘the year of IoT intelligence at the edge,’ with an increased focus on resiliency and
Novosense launches quad-channel digital isolators
Novosense expands its family of digital isolators with quad-channel devices for industrial and automotive
Single-chip LCOS panel saves space
The Omnivision single-chip LCOS panel delivers high-resolution content for AR/XR/MR smart glasses in consumer and B2B
Current sensors meet SiC and GaN requirements
Allegro’s current sensors improve efficiency and minimize energy loss for SiC and GaN technologies in EVs, data centers and clean
Low-power MCUs target motor control
Extending its series of RA8 MCUs, Renesas introduces the RA8T1 group of low-power MCUs with specialized analog
NXP releases MCX A MCUs for edge computing
NXP Semiconductors has launched the first two families in its MCX A MCU series for embedded intelligent edge
High-side power switches target automotive
Diodes Inc. expands its IntelliFET self-protected MOSFET family with the first automotive-compliant, dual-channel, high-side power
Rohm adds 600-V SJ MOSFETs in a smaller package
Rohm offers a new five-model portfolio of 600-V SJ MOSFETs, housed in a smaller SOT 223-3 package, saving space in power supplies, pumps and
FPC/FFC connectors save board space
Hirose’s back-flip FPC/FFC connectors offer dual-contact functionality for simpler flex routing, targeting space-constrained