ST claims first FIPS 140-3 certified TPMs STMicroelectronics introduces FIPS 140-3 certified trusted platform modules (TPMs) for computer, server and embedded
Broadcom launches 200G/lane DSP PHY for AI clusters Broadcom’s Sian2 DSP PHY delivers 200G/lane for AI data centers, enabling 800G and 1.6T optical
Samsung unveils automotive SSD for on-device AI Samsung’s 256-GB AM9C1 automotive SSD integrates 8th-generation V-NAND, 5-nm controller and SLC mode
Computer-on-modules deliver 39 TOPS AI performance Congatec’s COM Express conga-TCR8 computer-on-modules feature AMD Ryzen Embedded 8000 Series processors for AI applications at the
The road ahead for data centers on wheels Taking advantage of data-center technologies will accelerate the pace of innovation and solve the automotive industry’s biggest challenges in
CO2 sensor improves building air quality Infineon extends its CO2 sensor family with the XENSIV PAS C02 5-V sensor for higher efficiency and improved air quality in
AI noise suppression for a better listening experience AI noise suppression provides high-quality noise suppression in a range of audio applications while minimizing CPU load and
CXL memory module enables AI servers Innodisk’s CXL memory module meets the memory bandwidth and capacity needed for AI servers and cloud data
240-W PD 3.1 charger EVB delivers high efficiency Eggtronic’s SmartEgg 240-W PD 3.1 charger EVB delivers a peak efficiency above 95% and operates at over 90% efficiency from light to full
Infineon unveils 30-V StrongIRFET 2 power MOSFETs Infineon’s 30-V additions to its family of StrongIRFET 2 power MOSFETs deliver higher power efficiency for improved system