Partnership yields in-cabin sensing reference design Eyeris, Omnivision and Leopard Imaging will demo their new production reference design for advanced in-cabin sensing at CES
Qualcomm’s Snapdragon XR2+ Gen 2 chip targets 4K VR Qualcomm unveils its Snapdragon XR2+ Gen 2 single-chip architecture that enables 4.3K spatial computing at 90 fps for MR and VR
Bourns EdgMOV varistors save space Bourns’s EdgMOV varistors with high surge capabilities offer a variety of model options for performance and space savings in surge
Onsemi expands EliteSiC PIM series for EV charging Onsemi adds nine new EliteSiC power integrated modules for DC ultra-fast EV chargers and energy storage
Skyworks unveils AI noise suppression solution Skyworks will demonstrate its new AI noise suppression solution, developed for noise reduction in communications and recording systems, at CES
COM Express module delivers power savings Adlink’s cExpress-MTL COM Express module, powered by the new Intel Core Ultra processor, simplifies battery-powered edge
Rambus claims first Gen4 DDR5 RCD Rambus has announced the availability of its Gen4 DDR5 RCD, delivering a significant increase in DDR5 memory bandwidth and data
Samsung launches two sensors for robotics and XR Samsung expands its ISOCELL Vizion portfolio with two new sensors, targeting robotics and extended reality
Micro edge-card connectors support PCIe 6.0 Samtec’s HSEC6-DV micro edge-card connectors support 64 Gbits/s PAM4, PCIe 6.0 and CXL 3.0 for high-speed
RA8 MCUs target graphic displays The Renesas RA8D1 MCUs, based on the Arm Cortex-M85 processor, target graphic displays and voice/vision multimodal AI