Teledyne e2v unveils next-gen CMOS image sensors Teledyne e2v’s Emerald Gen2 CMOS image sensors deliver improved electro-optical performance and the flexibility to meet a range of
Picocom intros 5G O-RU SoC Picocom’s PC805 5G SoC delivers a small footprint and low power for 5G small cell O-RUs in enterprise, industrial, neutral host and private
Synaptics extends wireless SoC family for IoT The Synaptics SYN43711 wireless SoC reduces cost, space, power and complexity for secure IoT consumer and industrial
Survey: The current state of hardware reliability Molex’s reliability survey of design engineers and system architects reveals that less time for testing, supplier quality and cost are big challenges in hardware
Partnership to advance wearable brain sensing Presto and T&W Engineering are developing a custom ASIC for wearable brain sensing to aid in the early diagnosis of neurogenerative
Air coil inductors feature high Q Bourns introduces a new family of air coil inductors with high Q, high self-resonant frequency and low inductance
SemiQ expands QSiC family of SiC modules SemiQ expands the QSIC family with 1,200-V SiC modules in a SOT-227 package, targeting a range of applications, from EVs to medical power
TDK offers sample kit for high-current chokes TDK offers a sample kit of its EPCOS ERU33 series of shielded high-current chokes for automotive and industrial
Silicon Labs adds 8-bit MCU family Silicon Labs expands microcontroller offerings with new BB5 family of 8-bit MCUs for space-constrained
Viavi brings real-time analytics to O-RAN testing Viavi expands its NITRO Wireless platform with real-time analytics for O-RAN interoperability testing, E2E testing and