Indiana poised to become a new chip manufacturing hub
The next chip manufacturing hub may be in Indiana thanks in part to its participation in a Midwest semiconductor network and key innovation
Author: Gina Roos
Supercapacitor modules deliver high power density
The SCM series of supercapacitor modules from Kyocera AVX can be used in combination with primary or secondary batteries to extend battery life and backup
Optical sensor upgrades performance
Vishay’s VCNT2030 reflective optical sensor features a CTR of 31%, a 15-mm sensing distance and lower power consumption in a miniature
PCB relays provide industrial-grade power
Idec’s RC series of PCB relays offer industrial-grade power handling in a low-profile package, offering an alternative to plug-in
Infineon adopts recyclable PCBs for demo boards
Infineon is using recyclable PCBs to reduce the electronic waste and carbon footprint of its demo and evaluation
Schurter’s ‘Green Line’ reduces carbon footprint
The bio-based polymers used in Schurter’s Green Line products, designed from renewable materials, significantly reduce CO2
Intel offers 34 AI reference kits
Intel has introduced 34 open-source AI reference kits, designed to accelerate AI development and deployment across multiarchitecture
Ceva enhances NeuPro-M NPU IP family
Ceva’s enhanced NeuPro-M NPU IP addresses generative AI workloads to support transformer networks, CNNs and other neural
Bourns extends gas discharge tube series
Bourns has added a high-voltage 2-electrode overvoltage protector to its next-generation gas discharge tube
5G RF test system for FR1 reduces test time
Anritsu has developed a ‘lite’ version of the ME7873NR 5G RF conformance test system
for lower cost 5G FR1 TRx