Hailo expands Hailo-8 AI accelerator platform The new Hailo-8 Century and Hailo-8L extend the Hailo-8 AI accelerator platform for high-performance and entry-level applications,
Littelfuse claims first AEC-Q200-qualified fuses Littelfuse offers the industry’s first AEC-Q200 Revision E-qualified fuses, which are available in several family
MCU embedded power ICs add CAN-FD interface Infineon extends its MOTIX family of MCU embedded power ICs for automotive motor control with a CAN-FD interface for faster
Snap-in capacitors offer high capacitance density TDK has introduced a new series of EPCOS snap-in capacitors in an ultra-compact package size, delivering high capacitance
IR sensor detects up to four meters STMicroelectronics’ STHS34PF80 ultra-low-power IR sensor with micromachined thermal transistors detects up to four meters without an optical
Special report explores the factory of the future The EE Times special report on the factory of the future explores how Industry 4.0 is transforming manufacturing with advanced analytics, AI and
GNSS module tracks with sub-meter accuracy STMicroelectronics’ Teseo-LIV4F GNSS module leverages the company’s Teseo single-die receiver technology for higher positioning
60-GHz radar sensor delivers high integration Infineon’s new XENSIV 60-GHz radar sensor with antennas in package claims the smallest size in a 16-mm2
Mini-breakers receive automotive-grade approval Bourns’ Model AD and SD series mini-breakers are AEC-Q200 compliant and are manufactured in an IATF 16949 certified manufacturing
High-capacity HBM to advance generative AI Micron claims the industry’s first 8-high 24-GB HBM3 Gen2 with bandwidth greater than 1.2 TB/s for AI data