Collaboration yields energy-harvesting eval kit
Maxwell, Rohm and Lapis Technology have developed an energy-harvesting development kit using an all-solid-state
Author: Gina Roos
5G: Get ready for the next giant leap in performance
The capability improvements of 5G Release 17 and 18 brings challenges and opportunities to component and equipment
Silicon 100 tech startups to watch in 2023
EE Times has released its Silicon 100 report, now in its 23rd edition, unveiling the top 100 tech startups to watch in
Semiconductor test gets real-time analytics
Teradyne’s real-time secure edge platform optimizes semiconductor test processes necessary for today’s advanced
Samsung unveils GDDR7 DRAM
Samsung has claimed the industry’s first GDDR7 DRAM, with high graphics performance, targeting applications such as AI, HPC and
Top 10 5G chips and modules
The latest 5G chips and modules continue to make gains in integration, power efficiency and AI enhancements to deliver higher-performing 5G
Super-TCXO yields 100× higher reliability
SiTime’s SiT5543 Super-TCXO delivers greater stability and reliability in rugged environments, including aerospace and
650-V CoolSiC MOSFET available in TOLL package
Infineon has introduced its 650-V CoolSiC MOSFET in TO leadless (TOLL) packaging, enabling efficient power density and thermal
Non-terrestrial networks: The next big thing in 5G
Despite current technical challenges, 5G technology can potentially migrate parts of the mobile network infrastructure to space through non-terrestrial
Automotive LED drivers control up to 192 zones
Rohm’s BD94130xxx-M LED drivers provide local dimming capabilities to improve visibility and reduce power consumption in automotive