Micro-D connectors feature removable crimp contacts Littelfuse’s Micro-D connectors with removable crimp contacts target high-performance and harsh-environment
MEMS microphone targets automotive audio systems Infineon's automotive-qualified XENSIV MEMS microphone is designed for audio and active noise cancellation
Board-to-board connector shrinks by 71% Hirose has launched a new multi-RF board-to-board connector series that supports multiple RF and digital signals in a single
8K image sensor delivers wide area scanning Teledyne e2v’s Snappy Wide 8K wide aspect ratio CMOS image sensor targets logistics vision systems
Yokogawa upgrades optical spectrum analyzer The AQ6370E is an upgraded version of Yokogawa’s AQ6370D optical spectrum analyzer, with enhanced performance and
AMD adaptive SoC addresses emulation and prototyping AMD’s largest adaptive SoC boasts a range of improvements, which includes a doubling of the programmable logic density for emulation and
Wireless BMS powers EV adoption Wireless BMS delivers several advantages over a wired system like simplified design, higher reliability and lower
Special report: What RF wireless needs now The EE Times special report on RF wireless tackles the biggest challenges and drivers for next-generation components and
Broadcom intros Gen-2 Wi-Fi 7 chipsets Broadcom’s second generation of Wi-Fi 7 chipsets enable next-generation smartphone and access point platforms, expanding market
Melexis ToF sensors meet safety needs Melexis has expanded its portfolio of ToF sensors to support functional safety requirements of automotive and industrial