TVS diodes deliver USB-C ESD protection TDK’s micro-packaged TVS diodes protect voltage sensitive components from ESD for IoT, smart home and Industry 4.0
Multi-dimensional sensing improves touchscreens SigmaSense’s multi-dimensional sensing technology improves touchscreen performance, enabling advances for existing and new use
Survey: AI solves engineering challenges Monolith’s AI in engineering study reveals that the majority of engineering executives feel the pressure to adopt AI for competitive
Nexperia adds e-mode GaN FETs Nexperia has introduced seven e-mode GaN FETs in DFN packages for low (100/150 V)- and high-voltage (650 V)
Vishay expands line of SiC Schottky diodes Vishay has added 17 Gen 3 650-V SiC Schottky diodes, delivering lower forward voltage, capacitive charge and reverse leakage
Wireless charging transmitter supports up to 50 W Infineon’s WLC1150 wireless charging transmitter IC supports 50-W power transfer via a high-power charging protocol and wide input voltage
BMS features advanced software Sensata’s compact battery management system (BMS) helps to improve vehicle range, uptime, battery health and
Micro-coaxial cable eases routing Times Microwave Systems’ compact micro-coaxial cable delivers flexibility for easier routing in space-constrained
5 ways manufacturers benefit from AI in chip design AI can make chip design faster, more accurate and cost-effective, while mitigating a growing tech talent
ST launches next-generation edge AI MPUs STMicroelectronics’ second generation of Industry 4.0-ready 64-bit edge AI MPUs comes with SESIP Level 3