Delivering multi-stream wireless audio streaming with ultra-low power consumption and latency, NXP Semiconductor’s new NXH3675 audio chip is certified to the Bluetooth 5.3 Low Energy (LE) audio standard. The integrated single-chip 2.4-GHz transceiver enables designers to add features such as high-quality audio transmission, broadcasting capabilities, and multiple audio streams and data channels. To simplify design, a starter kit is available, which includes an evaluation kit for debug and evaluation, gaming headset and dongle application kits, and a software development kit.
Touting ultra-low latency with ultra-low power consumption thanks to NXP’s audio stream protocol for advanced use cases, target applications include gaming headsets, hearing aids, soundbars and TV transmitters, as well as wireless headphones, earbuds, speakers, and microphones.
For Bluetooth audio streaming applications, “the Bluetooth LE audio standard takes audio quality to the next level and brings a new way of experiencing audio,” said NXP. “The new standard enables audio sharing, hearing assistance, and new use cases that we could not even imagine having with classic Bluetooth audio.”
NXP, which participated in the recent Bluetooth 5.3 LE audio standard, said the new standard requires wireless transceivers with advanced audio processing capabilities that offer high power efficiency and ultra-low latency.
The NXH3675 audio chip is Bluetooth 5.3 LE audio certified with Auracast, a broadcast audio communication that enables audio sharing use cases in the 2.4-GHz radio band. The chip integrates a dedicated Arm Cortex-M0+ for supporting full flexible software link-layer protocol up to the HCI level to enable multi-stream applications.
The audio chip also includes a dual CoolFlux DSP for audio processing of the LC3 and LC3+ audio encoder/decoder and audio and voice enhancements such as EQ, compression, gain control, and mixing. Other features include a 16-MHz/32-MHz crystal oscillator with integrated tuning caps and automatic frequency selection, integrated flash memory, support for multiple digital PDM-based microphones, and multiple interfaces for control, data, debug, and test.
The NXH3675, housed in a WLCSP package (9.1 mm2 with 48 bumps), is sampling now. Starter, application, and software developments also are available.
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