Board-to-board connectors feature low stacking heights

By Gina Roos, editor-in-chief

Kyocera Corp. released its 5655 Series of board-to-board connectors for high-speed data transmission applications. The connectors offer a 0.5-mm pitch and a stacking height of 4 mm, and feature a proprietary floating structure optimized for high speed. These are considered one of thinnest for this class of connector — 0.5-mm pitch with a floating contact structure.

Other key features include a dual-point contact structure that ensures excellent contact reliability, and a molded structure for durability, reducing breakage when connecting or disconnecting. The connectors meet the MIPI D-PHY standard (2.5 Gbits/s) for high-speed transmission interfaces, and can operate in extreme temperatures from -40°C to 125°C.

The connectors provide a rated current of 0.7 A/pin. Kyocera also offers versions rated up to 3 A/pin for high-current power. Other versions up to 7 mm are also available. See the  video clip for more information.

The target market is automotive electronics, including millimeter-wave radar, LiDAR, e-mirrors, navigation systems, and cameras. This is driven, in particular, by the commercialization of autonomous driving systems that require miniaturized electronics with limited space within the vehicles, according to Kyocera.

Samples are available on request. Kyocera plans to exhibit the new connectors at electronica India 2019, September 25-27 in Delhi, India (Hall 11, Booth #EG01).