By Gina Roos, editor-in-chief
Boréas Technologies has extended its flagship low-power piezoelectric driver IC product with a wafer-level chip-scale (WLCSP) version for high-definition (HD) haptic feedback in mobile and wearable consumer products. Housed in a 2.1 × 2.2 × 0.6-mm package and consuming one-tenth the power of its nearest piezoelectric competitor, the BOS1901CW is suited for resource-constrained devices such as buttonless smartphones, smartwatches, game controllers, and other battery-powered devices.
Like Boréas’ BOS1901CQ, in a 4 × 4 × 0.8-mm QFN package, the BOS1901CW is a high-voltage low-power piezo driver IC that is based on Boréas’s patented CapDrive technology, a proprietary scalable piezo driver architecture that provides the foundation for Boréas’s haptic chips. Advantages of CapDrive include greater energy efficiency, low heat dissipation, and fast response times.
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Key features include:
- Provides 10× power savings over other piezo solutions and delivers 4× to 20× power savings over other incumbent technologies (LRA, ERM). See Boréas’s Haptic Technologies Showdown.
- Tiny footprint of 2.1 × 2.2 × 0.6 mm
- Delivers start-up time of
- Supports a wide range of piezoelectric haptic actuators and third-party haptic-effect libraries
- Wide supply voltage range of 3 V to 5.5 V
A plug-and-play development kit, the BOS1901-KIT, is available. For more information, email info@boreas.ca.
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