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Bridging the gap between RF front-end module characterization and production test with the semiconductor test system

National Instruments- Bridging the gap
The rapid evolution of wireless connectivity has driven the continual consumer thirst for more data throughput and reduced time to market. This white paper highlights some of the test challenges and explains how NI PXI instrumentation is meeting these demands in both characterization and production test environments with the same hardware and software platform.

View this in-depth white paper to learn how NI is bridging the gap between characterization and production with the Semiconductor Test System (STS).

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