Capacitors and resistors deliver higher performance

One thing that never changes in the passive component market is miniaturization. Whether it is shrinking the size of the capacitors and resistors or packing higher performance in the same package size, product designers are always looking to save space and costs. This is true across industries from consumer electronics and wearables to automotive and industrial.

At the same time, designers want better performance. This often means higher capacitance/voltage (C/V) ratings in the same or smaller package sizes for capacitors as well as lower equivalent series resistance (ESR) and equivalent series inductance (ESL). For resistors, this translates into higher power ratings in miniaturized footprints to meet higher-density requirements or higher working voltages, particularly for automotive and industrial applications.

Also, more applications require these passive components to operate at higher temperatures and in harsh environments. Many of these improvements are achieved through materials development and component design changes.

There is also an increased adoption of silicon capacitors thanks to the ongoing miniaturization of consumer electronics products. In addition to their small size, these silicon capacitors offer high stability and reliability over a wide temperature range, making them suited for a range of applications.

Here is a selection of capacitors and resistors introduced over the past year that meet the growing demand for smaller packaging and higher performance in a range of applications.

MLCCs

Multilayer ceramic capacitors (MLCCs) are used in a wide range of applications, particularly in consumer electronics and mobile devices, thanks to their small size, capacitance range and pricing. However, the automotive industry, particularly for hybrid and electric vehicles, are driving increased demand for these tiny devices with wider operating temperatures and higher operating voltage ranges.

One of the most recent product introductions is an automotive MLCC portfolio from Samsung Electro-Mechanics. The lineup of five high-voltage MLCCs targets on-board chargers (OBCs) in EVs. They can withstand high-voltage applications, with working voltages of either 1,000 V or 630 V.

Samsung said vehicles use at least 3,000 to 10,000 MLCCs for applications like powertrains, safety and infotainment and that demand is growing in EV applications. OBCs have used film condensers to eliminate signal noise, but more recently, the working voltage and frequency have increased to accelerate the charging speed, the company said. As a result, the demand for MLCCs that offer high reliability in high-frequency environments has increased in EVs.

These automotive MLCCs can withstand high voltage and improve battery stability by eliminating high-frequency noise in the battery system. EV battery systems use voltages of up to 400 V, and these high-voltage 630-V and 1,000-V MLCCs more than double the safety margin required to operate reliably in this environment, the company said.

The high-voltage line includes three parts with a 1,000-V rating: 15-nF and 22-nF MLCCs in a 3225 package size (3.2 × 2.5 mm) and a 1-nF device in a 3216 size (3.2 × 1.6 mm). Rounding out the new portfolio are two devices with a 630-V rating, providing a 33-nF capacitance in a 3225 size and 10 nF in a 3216 size.

The high-stability operation even at high voltages is thanks to Samsung’s in-house raw materials development and a change in the structure of internal electrodes. The company has also improved the heat-generation characteristics by applying a new process method.

Also aimed at high-reliability markets is the GJM022 series from Murata Manufacturing Co. Ltd., touting a high-Q factor, typically required for high-frequency or high-power applications. Claimed as the smallest high-Q 100-V MLCC for consumer electronics and industrial equipment, the GJM022 is designed for high-frequency modules, such as those used in cellular communications infrastructure.

Thanks to Murata’s state-of-the-art thin-layer-forming and high-precision laminating technologies, the new MLCCs deliver performance—high Q and low loss—in a small, 0.4 × 0.2-mm package.

The GJM022 series is suited for impedance matching in RF modules for base stations. The high-Q value and low ESR help with power amplifier efficiency and lower power consumption.

The capacitance range (COG and X8G dielectrics) is 0.20 pF to 22 pF. The COG capacitors offer rated voltages of 16 VDC, 25 VDC and 100 VDC and an operating temperature range of –55°C to 125°C. The X8G devices are available at 25 VDC and 100 VDC with an extended temperature range of 150°C.

The GJM022 offers a high temperature guarantee of 150°C that enables long-term operation, even in close vicinity to hot components, such as power semiconductors, Murata said.

Snap-in aluminum electrolytic capacitors

Not surprisingly, capacitor makers are developing snap-in aluminum electrolytic capacitors for industrial applications. These capacitors are typically highlighted by “robust” construction and easy installation, as well as their ability to handle high ripple currents, which make them suitable for industrial applications like power inverters and power supplies.

Kyocera AVX’s SNA and SNL series of snap-in aluminum electrolytic capacitors deliver high-reliability, high-voltage and C/V performance, in addition to easy installation thanks to fully insulated cases with polarity markings. These capacitors target a range of commercial and industrial applications.

Both are rated for an extended operating temperature range of –25°C to 105°C and feature safety vents for overload protection.

The SNA Series features high-ripple-current capabilities, long lifetime performance and endurance of
5,000 hours at 105°C. It is available with three rated voltages—250, 420 and 450 VDC—and capacitance values ranging from 82 µF to 1,500 µF, ±20% tolerance. It is available in 24 case sizes, measuring 22 × 25 mm to 35 × 50 mm (D × L).

The SNL Series offers an endurance of 3,000 hours at 105°C. It is available with eight rated voltages—160, 200, 250, 350, 400, 450, 500 and 550 VDC—and capacitance values ranging from 68 µF to
2,200 µF, ±20% tolerance. It is available in 36 case sizes, ranging from 22 × 20 mm to 35 × 60 mm (D × L).

TDK Corp. also offers a series of compact snap-in aluminum electrolytic capacitors. The EPCOS B43659 series, for general-purpose applications, offers high C/V performance with a capacitance range from 140 µF to 1,030 µF, at 450 VDC. It offers the same features as the previous series but in a smaller package, ranging from 22 × 25 mm to 35 × 50 mm (D × H). In addition to the standard versions with two terminals, three-terminal versions are also available to ensure correct installation.

Key features include a high-ripple-current capability of up to 7.01 A (120 Hz, 60°C) and a service life of at least 2,000 hours at a maximum operating temperature of 105°C. TDK offers its web-based AlCap Tool for accurate lifetime calculation under application-specific conditions.

These RoHS-compliant aluminum electrolytic capacitors can be used in a wide range of applications, such as switch-mode power supplies, frequency converters, uninterruptible power supplies, medical equipment and solar inverters.

Silicon capacitors

With their miniaturization and high stability and reliability over a wide operating temperature range, silicon capacitors are being adopted as a replacement for MLCCs in a range of applications from IoT devices to computing and industrial. They can operate with high-frequency circuits.

Empower Semiconductor recently launched its 16.6-μF EC1005P ECAP silicon capacitor with ultra-low ESL that can be embedded into any system-on-chip (SoC) substrate or interposer. Addressing the power integrity and voltage regulation required by high-performance SoCs and other large computing processors, the company describes the EC1005P as its largest silicon capacitor in its ECAP product family for high-frequency decoupling.

The EC1005P features ultra-low impedance up to 1 GHz in a low profile that can be embedded into the substrate or interposer of any SoC. This silicon capacitor is suited for high-performance computing and artificial-intelligence applications. The ECAP series offers an operating temperature range of –55°C to 125°C.

Empower said the EC1005P features close-to-ideal parasitic parameters, which allows the SoCs to operate with reduced voltage margining, ultimately reducing system power. The silicon caps address the “last inch” decoupling gap from the voltage regulators to the SoC supply pins, replacing several discrete components with lower performance and a larger footprint, with a single monolithic device.

Key specs include an ultra-low, sub-1-picohenry ESL and sub-3-mΩ ESR. The silicon capacitor is housed in a 3.643 × 3.036-mm 120-pad chip-scale package, with a standard 784-micron profile that can be customized for various height requirements. This device provides high stability over voltage and temperature and is not subject to derating or aging like traditional MLCCs, the company said.

Rohm Semiconductor recently introduced its first silicon capacitor, the BTD1RVFL series, aimed at smartphones, wearables and other compact devices. Using thin-film semiconductor technology, these silicon capacitors can provide a higher capacitance in a thinner form factor than existing MLCCs, Rohm said. They also provide stable temperature characteristics and high reliability.

Leveraging its proprietary semiconductor processes, Rohm’s silicon capacitors are manufactured using proprietary RASMID miniaturization technology that allows processing in 1-µm increments, which eliminates chipping during external formation and improves dimensional tolerances within ±10 µm. This enables mounting with a narrower distance between adjacent components. Rohm also expanded the backside electrode—used for bonding to the substrate—to the periphery of the package to improve mounting strength.

Rohm claims the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) offers the industry’s smallest 01005 size (0.1 × 0.05 inch)/0402 size (0.4 × 0.2 mm) mass-produced surface-mount silicon capacitors. The mounting area is reduced by approximately 55% to 0.08 mm², compared with 0201 size (0.2 × 0.1 inches)/0603 size (0.6 × 0.3 mm) products, contributing to greater application miniaturization. The series also features a built-in TVS protection element for high electrostatic-discharge resistance.

Thick-film chip resistors

Thick-film chip resistor manufacturers are continually addressing the need for high density. One of these new products is the reverse-geometry NRC-RA Series of thick-film chip resistors recently introduced by NIC Components Corp. It offers a higher power rating in a standard thick-film package using reverse geometry.

These automotive-grade, AEC-Q200-qualified devices meet the higher power ratings in a small package size by using a reverse geometry, which places the terminals across the longer side of the component. NIC said this strategy increases the power rating and withstanding voltage within the same physical size.

The NRC-RA series is available in three reverse-geometry case sizes: 0612, 1020 and 1225. It offers E-24 and E-96 resistance values range from 1 Ω to 1 MΩ in ±1% (F), ±2% (G) and ±5% (J) tolerances. The operating temperature range is –55°C to 125°C.

For example, compared with the NRC series thick-film chip resistors in a 1206 footprint with a ¼-W power rating, the NRC-RA in a reverse-geometry 0612 footprint offers a ¾-W power rating. The NRC in a 2010 package offers a ¾-W power rating, compared with the NRC-RA in a 1020 package with a 1-W rating. The NRC in a 2512 package provides a 1-W rating, compared with the NRC-RA 1225 package with a 2-W rating.

The NRC-RA Series meets PB-free reflow conditions up to 260°C and is RoHS-compliant, halogen-free and REACH-compliant.

Vishay Intertechnology Inc. offers a series of space-saving, automotive-grade thick-film chip resistors in the 2512 case size with high working voltages up to 1,415 V. The Vishay Techno CDMA series devices are designed to lower component count and placement costs in automotive and industrial applications. These passive components reduce PCB sizes and provide increased accuracy and stability in these applications.

These chip dividers consist of two resistors integrated into a single package with a 5-mm creepage distance. They provide single-component replacements for multiple discrete resistors used in voltage-divider applications. The AEC-Q200-qualified devices are optimized for voltage monitoring and overvoltage protection in high-power DC/DC converters and inverters, OBCs and battery management systems in EVs, and industrial equipment.

The CDMA series offers a wide resistance range from 500 kΩ to 50 MΩ, with maximum standard resistance ratios to 600:1, tolerances down to ±0.5 % and temperature coefficient resistance (TCR) tracking as low as ±10 ppm/°C. The operating temperature range is –55°C to 155°C.

These devices are RoHS-compliant and halogen-free. The chip dividers feature a three-sided wraparound termination configuration, with solder-coated nickel barrier terminations.

Thin-film resistors

Thin-film resistors are known for their high precision, and more applications, such as automotive and industrial, are requiring higher precision. At the same time, some of these applications need anti-sulfur and anti-surge performance.

Yageo Group recently launched its NT series of high-precision tantalum nitride thin-film chip resistors. These chip resistors are moisture- and sulfur-resistant for medical, aerospace, telecommunications and test and measurement applications.

The series features a self-passivation design that forms a waterproofing layer, preventing moisture from penetrating from the outside by shielding the resistive layer. Yageo said this allows the NT Series resistors to maintain their performance in harsh environments.

The NT Series is available in case sizes from 0402 to 1206, a resistance range of 100 Ω to 481 kΩ and narrow tolerance of ±0.1%, ±0.25%, ±0.5% and ±1%. It also offers TCRs of ±25 ppm/°C and ±50 ppm/°C and a power rating range of 1/20 W to 2/5 W. The operating temperature range is –55°C to 155°C.

Stackpole Electronics Inc. offers the RNCL series of high-power and anti-surge thin-film chip resistors for a range of applications. One of the big demand drivers for anti-surge resistors is the need to protect consumer electronics devices like smartphones, laptops and wearables from power surges and voltage strikes.

High power and accuracy are becoming increasingly important for power management in consumer electronics, computer and peripheral devices, measurement systems and industrial power control and delivery, Stackpole said. Although there is a range of technology options for lower resistance values used for these applications, such as all-metal elements, this technology also tends to be the most expensive and usually provides tolerances of only 1% and higher, the company added.

The RNCL resistors provide high power ratings per chip size, with resistance values down to 50 mΩ. They also provide high precision and stability, with tolerances down to 0.5% and TCRs of 50 and 100 ppm. This series shows a very low-resistance shift of less than 1% under IEC industry-standard tests for short time overload, load life and biased humidity.

These resistors also offer a significantly higher pulse handling than typical thin-film chip resistors due to proprietary materials and design, Stackpole said.