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Copper catches on with more IC vendors

Copper catches on with more IC vendors Copper interconnections in place of the usual aluminum is no longer exclusively an IBM technique for IC fabrication.Continue

Enclosure horizons broaden

Enclosure horizons broaden Once little more than sheet metal that housed equipment, today's enclosures are likely to include a power supply and cooling, as

New protocols double VMEbus bandwidth

New protocols double VMEbus bandwidth Motorola Computer Group (Tempe, AZ) has announced it will implement the 2eVME and 2eSST VMEbus protocols currently being developed

Industry alliance looks beyond PCI

Industry alliance looks beyond PCI Looking to a time when the PCI bus will prove inadequate, the Future I/O Alliance held its first developer's conferenceContinue

Choosing a DSP for low-power designs

Choosing a DSP for low-power designs Picking the optimal processor for a low-power design requires careful analysis of both the DSP hardware and software

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