Tuning varactor diodes offer range of options High-Q tuning varactor diodes come in abrupt, hyperabrupt, and super hyperabrupt versions for operation at VHF to
Chip-scale packaging gets tougher and tinier Industry's smallest ICs are environmentally sealed to withstand harsh conditions A series of ICs in environmentally
FPGA '99 emphasizes computational applications FPGA '99, the seventh International Symposium of the Association for Computing Machinery on FPGAs, will meet on
Challenges of high-density-packaging assembly dominate Nepcon West Chip-scale and other kinds of high-density packaging will be the hot issues at the upcoming Nepcon
Iris recognition system expands biometric identification field The PC Iris recognition system from IriScan (Marlton, NJ) uses the unique characteristics of the iris of
Coming ASIC process combines copper interconnect, 0.15-µm gates Just as its 2.0-µm VSC10 process reaches full production, VLSI Technology (San Jose, CA) has
Microrelay brings MEMS technology to commercial market A microrelay from MCNC (Research Triangle Park, NC) employs microelectromechanical system (MEMS) technology to
New SCSI standard spurs mass-storage solutions Higher throughput and backward compatibility extend the life of the SCSI standard well into the millennium Building on
Lab-on-chip tests DNA A microfabricated sensor is poised to become the key component in portable DNA analysis. Researchers at the University of Michigan College
RIMM socket emerges for high-speed Rambus chips For the past six years, Molex (Lisle, IL) has played a major role in the development of interconnectionContinue