Programmable logic evolves with improved foundry processes
Programmable logic evolves with improved foundry processes Increased density permits architectural variations, including hard cores BY RODNEY MYRVAAGNES Associate Editor
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Microdisplays go high res
Microdisplays go high res Smaller displays with quality images are poised to empower handheld devices The strong demand for high information content in the nextContinue
SFF connectors make fiber-to-the-desktop a reality
SFF connectors make fiber-to-the-desktop a reality Latest fiber-optic connectors simplify fiber installation and help to lower fiber costs in emerging networks BY
The standards behind V.90 and ADSL modems
The standards behind V.90 and ADSL modems Principles of operation, physical limits, and legal requirements determine implementations of digital subscriber
DSPs expand in power and specialization
DSPs expand in power and specialization Even fully programmable chips show a tendency to be tailored to specific industries or applications BY RODNEY MYRVAAGNES
Fingerprint sensor promises low-cost security for PC peripherals
Fingerprint sensor promises low-cost security for PC peripherals Device uses new approach to address cost, reliability, and size concerns Based on opto-electrical
Overlooked processor architectures meet ongoing challenges
Overlooked processor architectures meet ongoing challenges At Hot Chips 10 this year, several processor architectures that are often overlooked demonstrated solutions to
Via-on-chip package aims at high-rel, high-density ICs
Via-on-chip package aims at high-rel, high-density ICs To accommodate high-performance ASICs and microprocessors, W.L. Gore and Associates (Newark, DE) has developed
RF ICs signal new opportunities
RF ICs signal new opportunities for wireless design Semiconductor advances benefit mainstream designers as well as RF specialists BY DAVID MORRISON Associate Editor
Affordable glass-ceramic carrier houses single-chip systems
Affordable glass-ceramic carrier houses single-chip systems Package provides high performance and reliability without using costly thin films A patented chip carrier