New IC packages cram more into tighter spaces
New IC packages cram more into tighter spaces Two new IC packages, one from Texas Instruments (Dallas) and the other from SGS-Thomson Microelectronics (Lincoln,
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PREP extends programmable-logic benchmarking to synthesis
PREP extends programmable-logic benchmarking to synthesis The Programmable Electronics Performance Corp. (PREP), Los Gatos, CA, has launched a new service that promises
AS-i sensor bus holds promise according to user poll
AS-i sensor bus holds promise according to user poll Bus lives up to initial claims of low cost and easy installation Designed to interconnect controlContinue
Industrial engineers chip in to make IC fabs more productive
Industrial engineers chip in to make IC fabs more productive With demand for semiconductors on the rise, IC manufacturers are being pressured to expand theirContinue
Capturing glitches on a DSO
Capturing glitches on a DSO Both Peak Detect and Glitch Trigger are valuable scope functions for capturing and analyzing data BY JOHNNIE HANCOCKHewlett-Packard Co.
BIST meets the challenges of core-based design
BIST meets the challenges of core-based design As integration levels spiral ever upward, core-based chip design becomes an increasingly attractive means of enabling
Built-in fuses cut packaging size and costs
Built-in fuses cut packaging size and costs Fuses are designed into flex circuits with user-specified characteristics A patented process makes fuses part of flexible
Single-chip architecture to simplify design of network-switching equipment
Single-chip architecture to simplify design of network-switching equipment Devices will support all major Ethernet standards Texas Instruments Inc. (Dallas, TX) has
New 16-Mbit Rambus DRAMs cut latency and improve bandwidth
New 16-Mbit Rambus DRAMs cut latency and improve bandwidth The latest generation of Rambus dynamic RAMs from the five semiconductor partners of Rambus Inc.(Mountain
Specifying incandescent lamps
Specifying incandescent lamps By actively controlling often-unlisted device parameters, the designer can achieve higher overall product reliability, performance, and