Technology trends in FPGA design tools
DATAIO.NOV–Data I/O Corp.–RP–4– — Technology trends in FPGA design tools To use higher-gate-count devices efficiently, designers must
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Chip-scale packaging comes to the forefront
Chip-scale packaging comes to the forefront This technique produces packaged parts that are barely larger than the die being housed, reaping huge space savings
ISDN chipsets to show substantial growth to 1999
ISDN chipsets to show substantial growth to 1999 U.S.revenues for basic rate interface (BRI) chipsets are expected to grow from $50.4 million in 1994 toContinue
42-in. full-color plasma displays to debut at Comdex ’95
42-in.full-color plasma displays to debut at Comdex '95 Following its successful launch in 1992 of the first mass-produced 21-in.color plasma display panel (PDP),
In multimedia development, everybody has an idea
In multimedia development, everybody has an idea Papers on multimedia at the Microprocessor Forum last month in San Jose, CA, showed a diversity of approachContinue
Getting answers from a digital scope
Getting answers from a digital scope In many applications, a DSO's processing power is the key to its performance BY MIKE LAUTERBACH LeCroy
Specifying a VCXO for communications
Specifying a VCXO for communications Should a system designer rigidly spec out a voltage-controlled crystal oscillator or simply spec operating conditions and required
End in sight for PCMCIA woes?
End in sight for PCMCIA woes? Windows 95, with its Plug and Play Framework Architecture, may well herald the end to PCMCIA interoperability frustrations BYContinue
PCI respun–again!
PCI respun–again! While CompactPCI can exist side by side with present embedded systems architectures, it may well become the bus of choice Empowered by
Specifying front-end ac supplies for telecommunication systems
Specifying front-end ac supplies for telecommunication systems To ensure smooth, reliable power delivery, designers must consider additional safety and performance