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BGA socket/adapter

BGA socket/adapter Subjects the BGA to less thermal stress than soldering a BGA to a motherboard; countersink in head of pin eases positioning onto adapter;Continue

BGA socket

BGA socket Combines pin board header reflow-mounted to the array package and a surface-mounted socket; accommodates all popular grids and spacings. 19 x 19-grid-position

DIP adapter

DIP adapter Placed between the DIP and its pc-board socket, allows circuit path to be directed to both DIP and pc board, or to isolateContinue

PGA socket

PGA socket 241-pin low-insertion-force socket for Motorola MC68360 processor; withstands temperatures from -60 degrees to +260 degreesC; available in board-height

Deciphering specs for high-speed D/A converters

Deciphering specs for high-speed D/A converters Device specification numbers are becoming even more important to meet today's high-performance design requirements BY

Motors and drives rise to the challenges of distributed control

Motors and drives rise to the challenges of distributed control Integration forms the basis of advances in brushless dc and step motors and drives thatContinue

More BGA choices emerge

More BGA choices emerge Up to now the only available ball grid array packages have been either plastic or ceramic. However, two recent announcements–metal

There’s magic in that chip

There's magic in that chip Intel's long-awaited P6 disclosures impress the most cynical observers Register renaming, speculative superscalar execution, deep

Single-kernel simulator marries Verilog and VHDL

Single-kernel simulator marries Verilog and VHDL A technology breakthrough that enables the seamless simulation of Verilog and VHDL has been announced by electronic

Fieldbus standardization?

Fieldbus standardization? While General Motors, Ford, and Chrysler make their requirements for an open, modular architecture controller (OMAC) known to the supplier and