Dc/dc converters rise to new challenges High-power, high-density parts emerge for distributed power BY SPENCER CHIN Associate Editor The familiar shoebox-style ac/dc
From Mips and Sun: Next-generation microprocessors First-quarter samples are promised for UltraSparc from Texas Instruments and R10000 from NEC and Toshiba Semiconductor
Small reels of surface-mount components meet short-run needs For years, component suppliers have shipped surface-mounted parts on 7-in.-diameter reels, which often have
Motorola samples its entry into FPGA market Motorola has entered the crowded, and Xilinx-dominated, field-programmable gate array market with a static-RAM-based device.
Wireless comm market to grow almost eightfold by 1998 The U.S.market for wireless communications equipment and services will grow from $2.03 billion in 1993 toContinue
PCI (alias PMC) becomes the mezzanine standard of choice Within the factious realm of mezzanine board standards, a newcomer, in the form of the PCIContinue
Power IC technology enhances system capability Driven by the demanding requirements of the automotive industry, power ICs are offering lower cost, higher integration,
Touchscreens are changing the face of computers Today's users have five types of touchscreens to choose from, each with its own unique characteristics BY BENContinue
High-reliability plastic aims to replace ceramic in military packages Light weight and low cost suit improved plastic for all but most crucial packaging needs
Electronic Products Forum The VXIbus Applications for the VXIbus have been growing steadily since the VXIbus specification was introduced in 1987. Participants at this