New process expands model availability
OL2.JUL–RP New process expands model availability A new model development technology offers to expand the availability of behavioral models for board and system
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Prototype yields lower-cost, higher-performance AMLCDs
OL3.JUL–SID–pm Prototype promises lower-cost, higher-performance AMLCDs As a step toward bringing down the cost of active-matrix LCDs (AMLCDs) while at the
SCSI test systems are changing
ADAPTEC.JUL–wy SCSI test systems are changing More complex SCSI peripherals and bus configurations are placing new demands on SCSI testers BY THOMAS W. MARTIN
Benchtop power supplies meet diverse testing needs
BENCHTOP.JUL–benchtop power supplies– SC– Page Benchtop power supplies meet diverse testing needs More instruments allow either local or remote control
Popular microcontroller family evolves for higher performance, regular structure
OL2.JUN–Motorola–RM Popular microcontroller family evolves for higher performance, regular structure Motorola (Austin, TX) has announced a new 8-bit
Low-power Mips processor has plastic package, power management
OL3.JUN–Mips Technology–RM Low-power Mips processor has plastic package, power management Chip aims at portable computers, laser printers, and other
At DAC 1993: Products focus on speed and performance
OL4.JUN–RP, SC At DAC 1993: Products focus on speed and performance The Very High Speed Integrated Circuit Hardware Description Language (VHDL), complex IC design,
Intel reinforces Multibus rear guard
OL.JUN–pm Intel reinforces Multibus rear guard In the face of continued VMEbus assaults, Intel Corp. (Santa Clara, CA) has moved to secure the Multibus
High-performance DRAMs
RAMTRON.JUN–Ramtron–rm High-performance DRAMs Manufacturers have developed several techniques to keep DRAMs in step with ever-faster microprocessors BY DAVID
Ceramic substrate allows mounting of devices directly on vias
OL #1–May–Micro Substrates–SC– Page Ceramic substrate allows mounting of devices directly on vias Traditionally, packages used for microwave