NEC sampling 64-Mbit DRAM in production process
April 6, 1993 RM NEC sampling 64-Mbit DRAM made with production photolithography Following its prompt release of the R4400 microprocessor, NEC has underscored its
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PCI board specification completed
OL3.MAY–PCI–pm PCI board specification completed The Peripheral Component Interconnect Special Interest Group (PCI SIG) steering committee has announced the
Pentium chipsets precede Pentium availability
April 1, 1993 RM Opti and Intel Pentium sets Pentium chipsets precede Pentium availability Opti Inc. (Santa Clara, CA) and Intel Corp. (Santa Clara, CA)Continue
VHDL simulation takes leap forward
RP-HL3.MAY VHDL simulation takes leap forward Next generation of simulator technology improves speed from two to 10 times With designs growing ever more complex,
Dc/dc converter packs 17 W/in.SUP3/SUP3
ELEC2.APR–Calex–SC Dc/dc converter packs 17 W/in.3 A small powerhouse, this single-output dc/dc converter provides up to 30 W in a package 2.02 (L) x
Choosing the right optical encoder for your control system
BEI.APR--BEI Motion Systems--pm Choosing the right optical encoder for your control system Answers to questions designers frequently ask about function, interface,
Optical encoders use leading-edge technology to conquer new markets
ENCODER.APR–pm Optical encoders use leading-edge technology to conquer new markets Fiber optics is one method being used to peel away the fragile label once
Avoiding VMEbus board incompatibilities
GAUNTLET.APR–Heurikon–pm Avoiding VMEbus board incompatiblities Despite a well established standard, VMEbus boards may fail in an intense, multiprocessing,
Ball grid array package challenges quad flatpack
OL1.APR–Motorola–SC– Page Ball grid array package challenges quad flatpack Since the latter part of the 1980s, the quad flatpack (QFP) has been a
Thin-film MCMs debut in low-cost standard packages
OL2.APR–MicroModule–SC Thin-film MCMs debut in low-cost standard packages Although the multichip module by and large remains a fairly expensive custom