Protecting electronic components from vibrational forces Capacitors are one of the most susceptible electronic components to vibrational forces, requiring the development of resilient and flexible
Imec demos integration of Schottky diodes and HEMTs with a GaN IC The combination of Schottky diodes and HEMTs with a GaN IC delivers increased performance, paving the way for more efficient power
Understanding the IEC 62368-1 standard for electronic equipment Applying the IEC 62368-1 standard to universal power adapters requires careful consideration of overcurrent and surge protection
New fabrication process delivers stable, high-mobility AOS TFTs Researchers at Tokyo Tech solve the trade-off between mobility and stability in AOS TFTs with a new fabrication
Special Project: 5G wireless deployments are ramping up 5G wireless deployments are at last ramping up, bringing benefits of greater bandwidth and reduced
Sony develops 2-layer transistor pixel technology for CMOS image sensors Sony's 2-layer transistor pixel technology for CMOS image sensors improves dynamic range and noise while doubling the saturation signal
FAANGs reshape the chip supply chain This group of global cutting-edge, cloud-centric companies, called the FAANGs, have an advantage when it comes to fab
IoT developer survey: Security is the biggest concern The Eclipse Foundation’s survey of more than 600 IoT developers reveals trends for edge computing, hardware architecture, security, and
PowerUP EXPO 2021: Fundamentals of GaN and SiC power devices AspenCore’s PowerUP Expo 2021 kicked off the three-day virtual conference with a deep dive into the fundamentals of GaN and SiC power
From 4G to 5G mobile networks: A natural progression 5G delivers low latency advantages for any application from playing a video game to controlling a robot