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Data centers bring thermal management challenges

Molex’s thermal management report finds optical I/O module power requirements have driven traditional cooling to its operational

Teledyne e2v tests and evaluates its LS1046 and LX2160 space-grade processors for data compression in space

The latest use cases and features enabled by sensor fusion include TWS earbuds with spatial audio and sports earbuds with heart rate

Advances in Bluetooth and MEMS microphone audio ICs deliver advanced wearables and previously impossible

PMICs are a ready-to-use option for implementing a complete power supply solution for battery-powered

Passive component manufacturers continue to deliver higher-performing capacitors and resistors in smaller package

These 10 tiny chips address the key design challenges of mobile devices and wearables with better performance in smaller

A TE Connectivity survey finds that engineers and executives do not agree on who should lead in AI and sustainability

Qi2 builds on the initial Qi protocol, delivering faster charging, improved safety and a better user

Perforce’s automotive software development survey finds that security is a rising concern as the market transitions to