PICMG defines COM-HPC Mini pinout and footprint
PICMG’s COM-HPC Mini standard is one step closer to ratification after finalizing the pinout and dimension
News: Latest industry information and company announcements
3 reasons to test electronics components
Here are three key reasons why product manufacturers need to test electronics components before and after
Wireless infrastructure timing solved
SiTime’s integrated wireless infrastructure timing solution delivers 30% higher reliability and improves environmental resilience by
ROHM and BASiC team on SiC power devices
Rohm Semiconductor and BASiC are collaborating to develop and improve the performance of SiC power devices for automotive
Report: Semiconductor talent shortage hurts growth
Deloitte finds that the semiconductor talent shortage is the biggest challenge to the industry’s growth and a new mix of skills and recruiting strategies are
MCUs pack flexible features for EV control
NXP launches a new series of MCUs for EV control applications, meeting requirements for zonal vehicle E/E architectures and software-defined
Engineers struggle with component shortages
An Avnet Insights survey finds that component shortages are changing design strategies, often impacting product development
4 ways nanotech can improve biophotonics
The use of nanotechnology in biophotonics has opened new opportunities that could lead to life-changing health
Hyperspectral cameras for smart farming
Imec takes hyperspectral imaging from the lab into the field with video-rate capabilities, solving challenges around implementation, scalability, and
Survey: Wi-Fi 7 will drive new IIoT use cases
The Wireless Broadband Alliance’s survey reveals that Wi-Fi 7 is a key area of investment in new connectivity