APEC roundup: Power devices simplify design with higher integration APEC 2022 showcases the latest and greatest power devices that deliver on key power trends, including a new selection of WBG
Microchip launches 3.3-kV SiC MOSFETs and SBDs Microchip Technology has expanded its SiC portfolio with 3.3-kV SiC MOSFETs and SiC SBDs for high-voltage power
TI unveils new buck converters and LDO linear regulator at APEC TI introduced two new buck converters and an LDO linear regulator at APEC that address design challenges for automotive and industrial
Survey: Component shortages impact product design An Avnet Insights survey of engineers finds that component shortages are changing the way they design, making more choices based on availability rather than
Renesas develops new Bluetooth LE RF transceiver technologies Renesas has developed two Bluetooth LE RF transceiver technologies that simplify board design, while reducing circuit size and increasing power
Imec recasts UWB transmitter and low-power flexible MPU technologies At the recent ISSCC conference, imec presented a fast and low-power UWB transmitter chip and a low-power flexible
MWC 2022: Partnerships drive innovation MWC 2022 showcases industry partnerships that are accelerating the adoption of 5G networks, Open RAN, and
Omnivision claims pixel technology breakthrough for image sensors Omnivision has developed the smallest 0.56-micron pixel with high QE performance for image sensors used in multi-camera mobile
MIPI CSI-2 camera spec adds advanced always-on imaging solution The MIPI Alliance updates the MIPI CSI-2 embedded image sensor interface that enables always-on, low-power machine vision
Servo controllers level up robotic automation Servo controllers are instrumental in helping engineers create new robotic designs that meet current and emerging