PCIM preview: Demos, sneak peeks and new products Power electronics manufacturers will showcase their latest power ICs at PCIM Europe, highlighted by WBG semiconductors and e-mobility
Data centers bring thermal management challenges Molex’s thermal management report finds optical I/O module power requirements have driven traditional cooling to its operational
CEA-Leti presents HD TSVs for smarter cameras At ECTC 2024, CEA-Leti presented new techniques for making thin and high-density through-silicon vias (HD TSVs) for AI-embedded CMOS image
Survey: AI disconnect between engineers and leaders A TE Connectivity survey finds that engineers and executives do not agree on who should lead in AI and sustainability
Automotive software: Security is a top concern Perforce’s automotive software development survey finds that security is a rising concern as the market transitions to
Display film increases brightness by up to 30% BrightView will showcase its new Polycarbonate Brightness Enhancing Film for high-performance displays at SID Display Week
Omnivision debuts machine vision unit, three new sensors Omnivision unveils its Machine Vision Unit and three new CMOS global-shutter image sensors at Automate
Embedded world 2024: SDVs and AI in automotive Automotive chipmakers announced new platforms and technologies to advance SDV development and AI in
Silicon Labs unveils wireless SoCs for energy harvesting Silicon Labs introduces its first and most energy-efficient wireless SoCs for developing energy-harvesting
Ambiq MCU runs AI on battery-powered devices Ambiq’s Apollo510 MCU enables AI inferencing on-device, eliminating the need for a dedicated NPU, while delivering 30× higher power