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CC2564MODN TI Bluetooth dual mode HCI module is a complete BluetoothBR/EDR/LE HCI solution

CC2564MODN can reduce host processing and power

This post sponsored by Texas Instruments.

The CC2564MODN TI Bluetooth dual-mode HCI module is a complete BluetoothBR/EDR/LE HCI solution that reduces design effort and enables fast time to market.

TI CC2564MODN for POD High-Res

Based on TI’s seventh-generation Bluetooth core, the HCI module provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit, the HCI module provides best-in-class RF performance. TI’s power-management hardware and software algorithms provide significant power savings in all commonly used BluetoothBR/EDR/LE modes of operation.

With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is pre-integrated with TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. The stack is also available for iPod® (MFi) solutions and on other MCUs. Some of the profiles supported include: serial port profile (SPP), advanced audio distribution profile (A2DP), human interface device (HID), and several BLE profiles (these profiles vary based on the supported MCU). In addition to software, this solution consists of a reference design with a low BOM cost. CC2564MODN is highly optimized for design into small form factor systems.

For more information about this product, click here.
For detailed information about the tool mentioned above, click here.
To request a sample, click here.
To download a datasheet,  click here.

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