Chipset for head-up display enables widest FoV in industry

The DLP3000-Q1 chipset is the first DLP chipset qualified for automotive head-up display (HUD) applications and offers the industry’s widest field of view (FoV) up to 12 degrees. It consists of a DLP 0.3-in. wide video graphics array (WVGA) digital micromirror device (DMD) and DLPC120 controller that allows augmented-reality elements such as navigational indicators and real-time landmark details to be displayed in the driver’s line of sight – with a depth perception of 2 to 20 meters ahead.

The chipset provides a HUD capable of producing 15,000 cd/m² of brightness, a dynamic dimming range of 5,000:1, contrast >1,000:1 full on/full off (FOFO), and 125% NTSC color-gamut performance that won’t degrade over temperature. DLP technology is light source-agnostic, it can leverage reliable light-emitting diodes (LEDs) while providing a future path to using lasers once they are available for automotive-qualified HUD applications. The whole system can be integrated into a variety of mechanical form factors such as a windshield or combiner HUDs.